We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Die bonder.
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Die bonder Product List and Ranking from 5 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:May 27, 2026～Jun 23, 2026
This ranking is based on the number of page views on our site.

Die bonder Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:May 27, 2026～Jun 23, 2026
This ranking is based on the number of page views on our site.

  1. ファスフォードテクノロジ Yamanashi//Industrial Machinery
  2. 澁谷工業 Ishikawa//Other manufacturing
  3. 兼松ＰＷＳ Kanagawa//Industrial Machinery
  4. 4 テクサス Tokyo//Industrial Machinery
  5. 5 Woyton Technologies Kanagawa//Trading company/Wholesale
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Die bonder Product ranking

Last Updated： Aggregation Period:May 27, 2026～Jun 23, 2026
This ranking is based on the number of page views on our site.

  1. Fasford Technology "SiP Bonder (DB830plus+)" ファスフォードテクノロジ
  2. Ultra-high precision flip chip bonder/die bonder FDB210P 澁谷工業
  3. ASMPT manufactured flip chip bonder/die bonder AFCPlus 兼松ＰＷＳ
  4. 4 ASMPT manufactured flip chip bonder/die bonder CoS 兼松ＰＷＳ
  5. 4 Texas Corporation Business Introduction テクサス

Die bonder Product List

1～9 item / All 9 items

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ASMPT manufactured flip chip bonder/die bonder CoS

ASMPT manufactured flip chip bonder/die bonder CoS

CoS (Chip on Submount) is a high-precision die/flip chip bonder.

CoS Alignment Accuracy: ±3µm@3σ Applications: Mainly laser applications The company's products utilize laser heating, allowing for rapid heating implementation compared to pulse heaters. Cycle Time: 5–15 sec/chip Bonding Methods: Eutectic solder, epoxy, UV-curable resin, laser bonding *Ultrasonic bonding is not supported. 〇 Other Die Bonder/Flip Chip Bonder Equipment Alignment Accuracy NANO ±0.3µm @ 3σ AFCplus ±1μm@3σ Nova + ±2.5μm@3σ 〇 Other ASMPT Equipment Available - Multi-laser dicing equipment - Wire bonder equipment - 2D and 3D package appearance inspection equipment - Other die bonder equipment (alignment accuracy 0.2µm–25µm) 〇 ASMPT Equipment Installation Achievements (Total Domestic and International): 2000 units per year for die bonders, 4000 units per year for wire bonders.

  • Bonding Equipment
  • Die bonder

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Texas Corporation Business Introduction

Texas Corporation Business Introduction

Thoroughly manage the situation and take action based on the guidelines to "raise" it.

Texas Corporation inherits the die bonding technology of Nidec Tosok Corporation and practices the automation of semiconductor manufacturing equipment based on that technology. We implement a safety-first management philosophy, thoroughly manage pre-conditions, and act in accordance with our guiding principles. 【Product Information】 ○DBD4200R / EBD4200R ○DBD4600S / EBD4600 ○DBD3580SW ○EBD4350S For more details, please contact us or download the catalog.

  • Other semiconductor manufacturing equipment
  • Die bonder

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Fasford Technology "SiP Bonder (DB830plus+)"

Fasford Technology "SiP Bonder (DB830plus+)"

Achieving high quality and high productivity! Further evolved high-precision SiP bonders compatible with 300mm wafers.

The FASFOR Technology "SiP Bonder (DB830plus+)" is a high-speed, high-performance die bonder that has further evolved from the DB800, which is specifically designed for SiP assembly and compatible with 300mm wafers. It achieves high quality and high productivity through the use of an intermediate stage and is equipped with a vision system that supports positional correction for multi-layer stacking. With clean technology to reduce particles during stacking, it is the optimal die bonder for thin dies and multi-layer stacking. 【Features】 - High quality and high productivity - Multi-layer stacking support - Thin die bonding technology - Clean technology For more details, please contact us or download the catalog.

  • Bonding Equipment
  • Die bonder

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ASMPT manufactured flip chip bonder/die bonder AFCPlus

ASMPT manufactured flip chip bonder/die bonder AFCPlus

AFC Plus is a flip chip bonder capable of bonding dies to wafers/substrates/dies with high precision.

"AFC Plus" is a device that enables bonding of high-precision, diced chips to wafers/substrates/dies using the company's patented alignment technology. 【Features】 - Alignment accuracy: ±1µm @ 3s - Alignment technology (patented) - Bonding methods during the joining process - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications】 - Alignment accuracy: ±0.2µ@3σ - Cycle time: 20 to 30 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 300 x 300 mm - Bonding force (load): 10g to 2kg - Joining methods: eutectic solder, epoxy, UV-curable resin, laser bonding *Ultrasonic bonding is not supported.

  • Bonding Equipment
  • Die bonder

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Dai Bonder "MEGA"

Dai Bonder "MEGA"

Equipped with a comprehensive inspection feature! It is possible to check the quality before and after bonding.

"MEGA" is a device that allows multiple types of chips to be bonded to a single substrate in one pass. By adding options, it is possible to vary the precision within a range of 25μm to 2μm. Additionally, it is equipped with comprehensive inspection functions that allow for quality checks before and after bonding. It can be used for various applications such as small-batch production, mass production, and R&D. 【Overview】 ■ Manufacturer: ASMPT ■ Product Name: Multi-chip compatible die bonder for epoxy bonding, UV bonding *For more details, please refer to the PDF document or feel free to contact us.

  • Bonding Equipment
  • Die bonder

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Ultra-high precision flip chip bonder/die bonder FDB210P

Ultra-high precision flip chip bonder/die bonder FDB210P

Ultra-high precision bonders that achieve both submicron accuracy and mass production capability.

This machine is a flip chip bonder that is optimal for mass production of optical devices that require both sub-micron level ultra-high precision assembly and high production, as well as devices that require high precision mounting. It also supports face-up mounting as an option.

  • Bonding Equipment
  • Die bonder

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Dia Attach System

Dia Attach System

Supporting the ever-evolving semiconductor applications!

We handle the die attach systems from Besi. To meet the ever-evolving semiconductor applications, we continue to evolve with advanced technology. Please feel free to contact us if you have any requests. 【Four Categories】 ■ Multi-Module Bonder ■ Epoxy Die Bonder ■ Soft Solder Die Bonder ■ Flip Chip Bonder *For more details, please download the PDF or contact us.

  • Other semiconductor manufacturing equipment
  • Bonding Equipment
  • Die bonder

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